| Specification | |
|---|---|
| Form Factor | COM Express® Type 6 Basic Module (125 X 95mm) |
| Graphics Base Freq. | 350 MHz |
| HW Encoding | One VEBox:H.264/AVC, H.265/HEVC, JPEG, VP9 |
| HW Decoding | Two VDBoxes:H.264/AVC, VP9, H.265/HEVC, AV1, VC1, MPEG2, JPEG/MPEG, MPEG2 |
| HW Acceleration | DirectX 11/12, Open GL 4.5, OpenCL 2.1 |
| BIOS | AMI BIOS |
| Memory Type/Speed | DDR4 SO-DIMM 3200MT/s up to 64GB |
| SATA | 4x SATA III (Port 0~3) |
| USB | 4x USB 3.2 Gen 2 (Port 0~3) 8x USB 2.0 (Port 0~7) |
| PEG | 1x PCIe Gen 4 x16 (can be configured to 1 x16, 2 x8 or 1 x8 + 2 x4) |
| PCI Express | 8x PCIe Gen 3 x1 (can be configured to 8 x1, 4 x1 + 1 x4, or 2 x4) Support Intel® RST for PCIe Storage for both x4 Link |
| Security | TPM 2.0 (Infineon SLB9670), Intel® AES-NI, Intel® SHA Extensions, Intel® DAL |
| Dimension | 125 x 95mm |
| Power DC IN | Normal: +12V DC AT/ATX mode |
| Storage Temperature | -20°C to 85°C |
| Operation Temperature | 0°C to 60°C (General Embedded SKU) 0°C to 60°C (Industrial 25W SKU) -40°C to +85°C (Industrial 45W/35W SKU) |
| Certification | Contact us |
| OS | Windows 10, Ubuntu, CentOS, Yocto |
| Ordering Guide | |
|---|---|
| PCOM-B657VGL | 11th Gen Intel® Core™ Processors (Tiger Lake-H) DDR4, PCIe Gen 4, USB 3.2 Gen 2, 2.5 Gigabit TSN Ethernet, SATA III, TPM 2.0, DDI, eDP/LVDS and VGA |
